Co-Op - Failure Analysis

Description

This is a Failure Analysis Engineering Co-Op (Summer/Fall) position located in the SKYWORKS Austin Texas facility.  The Austin Failure Analysis team supports all customer, manufacturing qualification, design and yield analysis for the Mixed Signal Solutions (MSS) business unit.  As an Engineering Co-op in the Austin failure analysis laboratory, you will be introduced and trained in the operation and usage of electronic test equipment and various XRAY, optical, laser scanning, acoustic and scanning electron microscopy tooling and techniques.  You will be trained in the utilization of advanced microscopy fault isolation techniques including IR-emissions (hot spot), visible light emissions (photon emissions) and laser induced techniques such as TIVA (Thermally Induced Voltage Alteration).   You will learn and practice various physical failure analysis de-processing methods such as mechanical polishing, wet/chemical etching as well as general lab equipment utilization like soldering re-ball and usage of various electronic test interfaces.  You will be introduced and mentored in how to use package assembly and die level schematic engineering documentation in conjunction with test and failure analysis data to formulate failure analysis plans and troubleshoot to isolate failure mechanisms.  Ultimately failure analysis engineers must attain knowledge and skills to be able to develop, analyze, and report on laboratory findings that identify final product failure mechanisms.  FA engineers present their findings with multiple teams including quality, test and design engineering peers to analyze failure analysis data and identify failure mechanisms and determine root cause and planned mitigation.

Summer/Fall Co-op up to 6 months.

Responsibilities

Devise and execute parametric and functional test including bench test emulation while utilizing various parametric and benchtop test equipment.  Engineering knowledge or coursework in digital CMOS and HBJT and associated devices. Perform data analysis and troubleshoot electronic components including semiconductor chips, surface mount components, printed circuit boards and wire-bond and flip chip modules.  Communicate and interface with quality, reliability, and design teams to isolate failures and determine root cause.

Required Experience and Skills

• In pursuit of at minimum a BS degree in electrical engineering.  
• Ability to work on-site up to 6 months. 
• Strong understanding of electrical circuit fundamentals and a basic understanding or coursework in digital and mixed signal semiconductor fundamentals.
• Ability to learn how to troubleshoot and debug complex systems (hardware and test interfaces). 
• Posses knowledge of printed circuit board and chip design schematic capture and layout software tools.
• Have excellent written and verbal communication skills with the ability to report, as well as present, technical concepts and lab results in a direct and concise manner to a wide range of audiences including more senior engineers and technical management.
• Proficiency in Microsoft Office software including Outlook, Word, Excel, and PowerPoint.

Desired Experience and Skills

MSEE and/or PhDEE 

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