Principal Packaging Engineer
Date: Oct 1, 2024
Location: Austin, TX, US
Company: Skyworks
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.
At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Requisition ID: 74287
Job Description
Skyworks is seeking a Staff Packaging Engineer in the Skyworks Austin, Texas location to support the Mixed Signal Solutions Business Unit (MSSBU). The primary responsibility would be to support design with NPI packaging. You will be involved in the diverse areas of SOIC, Lead Frame, QFN, LGA, BGA and WLCSP package engineering assembly. As a highly skilled semiconductor Packaging Engineer, you will be a key player working with teams like R&D Engineers, Device, Process experts, Module Design Team, Program Management and Operations.
Responsibilities
The NPI Staff Packaging Engineer position will involve the following functions:
• Provide design support and material selection to assure high yielding, high reliability and low-cost products.
• Provide new packaging technologies as well as support to existing legacy products.
• Collaborate with cross-functional teams to ensure adherence to all design and technology rules, define technology choice, timelines, milestones and deliverables for new product launch.
• Lead end-to-end readiness ensuring a smooth transition from product development to production release, coordinating activities across Design, Process, Test, Operations and Module team to meet Quality, Performance and Schedule.
• Work with Skyworks’ Internal Assembly House in Mexicali and various OSATs across Asia for assembly location selection and subsequent assembly.
• Lead and coordinate the Product Readiness for each product release in the areas of Technology, Capability, Capacity and Cost. This includes Risk Assessments (design, process, technology) and Reliability at the different stages of the technology development to achieve Cpk and yield targets during NPI and Ramp-Up phase.
• Identify potential risks and challenges in the NPI process and develop mitigation plans.
Collaborate and openly debate with team to manage projects, solve problems, discuss challenging issues, and learn more about critical issues as a group.
• Report and maintain knowledge on product status to executive leadership by preparing appropriate reports.
Qualifications
• Mechanical Engineering degree required – B.S. with 10+ years experience.
• Strong Experience in New Product Introduction / Package Engineering / Design in the areas of SOIC,QFN, Lead Frame, LGA, BGA and WLCSP Semiconductor package assembly.
• Experience in semiconductor packaging assembly processes such as solder attach, die attach, wire-bonding, over-molding, materials curing, BGA, etc.
• Experience in IC packaging as defined in JEDEC, IATF and AEC standards.
• Strong experience of various electronic packaging technologies (SiP, MCM, WLCSP, Dual-sided packages etc.), structures, materials, and processes.
• Experience with IC packaging modeling & simulation and packaging failure analysis.
• Strong understanding of Product Development, manufacturing processes and supply chain management.
• Excellent leadership, communication with interpersonal skills and used to work in a multi-cultural environment.Knowledge in Project Management.
• Strong analytical and problem-solving skills, both technical and interpersonal.
• Must have excellent verbal and written communication skills and presentation skills.
• Works autonomously, well-organized, with a good attention to detail, while setting high standards in all aspects of the work
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The typical base pay range for this role across the U.S. is currently USD $126,500 - $241,700 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.
Nearest Major Market: Austin
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Package Design, Mechanical Engineer, Supply Chain Manager, Manufacturing Engineer, Engineer, Manufacturing, Engineering, Operations