Job Description
Job Title:  Packaging Engineering Intern
Posting Start Date:  10/26/26
Job Location(s):  Greensboro - Thorndike

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

 

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 78793 

Job Description: 

Description

 

 

Skyworks' Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Skyworks offers real work experience, exposure to upper management, and the opportunity to pursue full-time opportunities, as available. 

 

Skyworks' Internship Program offers:

  • Challenging, skill-building assignments
  • Mentoring and coaching from industry experts
  • Launch & Learns and other learning opportunities
  • Collaborative team-based work environment
  • Networking and social events
  • Final presentation to business leaders

 

Skyworks' Packaging Engineering Internships are offered in our Technology & Manufacturing (TMG) business group. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.

 

This position is not eligible for visa sponsorship by the Company.

 

Responsibilities

  • Learn about Advanced Packaging and Substrate Technology Development projects methodologies - to help and improve the process
  • Learn about Substrate Design Rules and Manufacturing Processes - Foster and mentoring
  • Review Assembly and Marking diagram - look for opportunities to improve
  • Plan and execute Design of Experiments in support of project deployment
  • Onsite hands-on learning semiconductor assembly processes -
  • Other minor activities related to documentation and continuous improvement (A3s - Lean)

Required Experience and Skills

  • BS in Materials Science, Chemical, Mechanical, or Electrical Engineering
  • Mechanical/Material/Chemical/Electrical Engineering skills
  • Communication and presentation skills
  • Ability to manage and drive problem resolution
  • Demonstrate strong analytical thinking skills
  • 3.0 GPA or higher

Desired Experience and Skills

  • Background with packaging materials (theoretical or practical). i.e. solder, epoxy, flux, mold compound preferred
  • Background with assembly process (theoretical or practical). i.e. Wire Bond, Die Attach, Flip Chip preferred
  • Experience with PCG Design Software (i.e. Altium, KiCAD, etc.) is preferred

The typical pay range for an Engineering intern across the U.S. is currently USD $29.00 - $49.00 per hour and for a Non-Engineering intern across the U.S. is currently USD $23.00 - $42.00 per hour. Starting pay will depend on level of education, the ultimate job duties and requirements, and work location. Skyworks has different pay ranges for different work locations in the U.S.

 

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworks.com.