Packaging Staff Engineer

Date: Aug 31, 2021

Location: Irvine, CA, US

Company: Skyworks


If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking.  Our work culture values diversity, social responsibility, open communication, mutual trust and respect.  We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.

Requisition ID: 65575 

Job Description

**This position can be based out of our Irvine, Newbury Park or San Jose, California offices**

Looking for a Staff Packaging Engineer to support new product development.  The candidate will be the RF packaging interface between design teams and internal/external manufacturing.

Your primary responsibilities will be:

• Working with IC design teams to define the package requirements.
• Ownership of specific products from feasibility stage to high volume production.
• Ensuring that DFM/BKM is implemented for assembly yield, cost, and reliability.
• Developing new assembly technologies, running process DOE’s, identifying new materials and equipment, reliability testing, and qualification of the new assembly process.

• Working with both internal assembly factory and external OSATs.

Job Requirements:

• BS Degree in either Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science.
• Minimum 5 years experience (or MS and 3 years) in semiconductor packaging technology
• Strong project management and communication skills (verbal, written, and presentation). 
• Experience with over-molded laminate module packaging processes:  SMT, Wirebonding, Die Attach, and Molding.
• Knowledge of various assembly processes:  Flip Chip, WLCSP, BGA, Module Level Shielding, and IPDs.

Preferred Experience:

• Hands-on experience with assembly process/equipment.
• Background in module design
• Understanding of RF products and concepts is highly desired.
• Experience with Failure Analysis.
• Understanding of Module and Board Level Reliability requirements.
• Understanding of manufacturing of organic laminate technologies.





Skyworks is an Equal Opportunity Employer.  All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.

Nearest Major Market: Irvine California
Nearest Secondary Market: Los Angeles

Job Segment: Package Design, Manufacturing Engineer, Engineer, Electrical, Network, Manufacturing, Engineering, Technology