Engineering Manager 2

Job Description

PRIMARY RESPONSIBILITY: Responsibilities include directing, leading and managing the technical activities in one or more engineering disciplines (mechanical, software, packaging, electrical, reliability, systems, applications, or process engineering). Evaluates final results of research and development projects to assure accomplishment of technical objectives. Selects, develops and evaluates personnel to ensure the efficient operation of the function.

Educational Qualifications:

• A Master's degree in Chemistry, Chemical Engineering, or a related field is strongly preferred.
• Extensive professional experience in a leadership capacity within the field may be considered as a substitute for specific educational qualifications.
• Required Skills and Competencies:
• At least 8 years of progressive experience in electroless/electrolytic plating processes, with a significant portion in a managerial or leadership role.
• Expert knowledge of plating chemistries, equipment, and advanced process technologies.
• Demonstrated success in leading troubleshooting efforts, analytical problem solving, and implementing effective process controls.
• Advanced proficiency in statistical analysis and experience with statistical software, such as JMP, for process optimization.
• Exceptional communication and interpersonal skills, with a proven ability to lead diverse engineering teams and collaborate effectively with senior management and external partners.
• High level of proficiency in English (written and spoken) for effective business communication.
• Willingness and ability to travel as needed to support business objectives and team development.

Desired Skills and Experience:

• Over 10 years of experience in plating and wet chemistry applications, with a strong emphasis on strategic process improvement and technological innovation.
• Comprehensive experience in managing production operations in high-volume manufacturing settings, with a focus on efficiency and quality.
• A track record of applying advanced engineering theories and principles to address complex industry challenges.
• Significant experience in R&D or industrial settings, specializing in Electroless/Electrolytic Plating processes.
• Mastery of plating metrology techniques, including XRF and XPS, and a deep understanding of analytical methods for plating chemistries.
• Thorough familiarity with IPC specification documents (e.g., IPC 4552) and a commitment to upholding the highest industry standards.

Essential Functions/Responsibilities:

• Strategically lead the research, development, and implementation of cutting-edge plating processes to drive industry-leading performance and innovation.
• Direct the optimization of throughput, quality, yield, and uptime for wafer plating equipment/processes, setting new benchmarks for excellence.
• Spearhead continuous improvement and lean manufacturing initiatives across the plating line, promoting a culture of excellence and efficiency.
• Develop comprehensive analysis protocols, chemistry bath life strategies, and maintenance schedules, leveraging advanced statistical process control techniques.
• Oversee the creation and maintenance of detailed process documentation, ensuring robust knowledge management and compliance with industry standards.
• Lead the design and execution of complex experiments (DOE) to address and resolve quality challenges, fostering a proactive approach to quality assurance.
• Guarantee that all products meet or exceed IPC thickness specifications and customer expectations.