Engineering Technician 6

Job Description

Job Description
As a technician 6 candidate in failure analysis, you have proven skills in the use of laboratory optical, acoustic, IR microscopy and X-RAY/CT tooling.  As a technician 6 you have experience in various sample preparation methodologies including: Mechanical polishing, Chemical and plasma decapsulation, Module re-ball and basic parametric I/V bench testing.  You have a proven track record of providing timely laboratory task completions and can follow engineering instructions involving various failure analysis physical and electrical analysis.   You will assist in the development of new techniques and maintain laboratory equipment and procedures in accordance with management and/or engineering directions.

Responsibilities  
-Execute module level re-ball and basic parametric I/V testing.
-Execute microscope imaging and digital capture using visible, IR, NIR, acoustic and X-RAY/CT microscopic systems.  
-Execute sample preparation using polishing, chemical and plasma decapsulation tooling and techniques.
-Communicate and interface with FA engineering and other quality, reliability, and design teams to perform routine laboratory imaging and sample preparation tasks.
Required Experience and Skills
-Minimum of 5 years of semiconductor FA laboratory experience.  
-Basic understanding of digital and RF semiconductor fundamentals.
-Ability to utilize, troubleshoot and debug various hardware and test interfaces.
-Experience with printed circuit board and semiconductor chip imaging and physical sample preparation. 
-Prior knowledge or familiarity in the areas of failure analysis tools and techniques including Visible, NIR and IR microscopes, X-RAY CT imaging, Acoustic microscopy (CSAM), Silicon (Si) and Gallium Arsenic (GaAs) wet/dry etching and mechanical polishing and sample preparation techniques.
-Excellent written and verbal communication skills with the ability to report, as well as present, technical concepts and lab results in a direct and concise manner. 
-Proficiency in Microsoft Office software including Outlook, Word, Excel.

Desired Experience and Skills
-Desirable to have prior knowledge or familiarity in the areas of die level planar polishing and cross section sample preparation, SEM (scanning electron microscope), NIR/IR emissions microscopes, Ion Beam Etching (IBE) and Reactive Ion Etch (RIE) tooling.
-Experience with digital and RF test equipment and measurements.
-A great attitude with an eagerness to learn and the ability to adapt to new technical challenges.
-Ability to build relationships easily and collaborate effectively.