Reliability/FA Engineer 2

Job Description

As an Engineer 2, you will develop, analyze, and report on laboratory results that   isolate final product electronic module component and device level failures.   You will inform quality, test and design engineering on selection, application of failure analysis tools and techniques applicable to troubleshoot and isolate defectivity through root cause of electronic components and systems. You will recommend test methods and various FA laboratory control procedures for achieving required levels of product fault isolation and root cause.  You will understand all test and product reliability requirements of components and systems to achieve company and customer and any governmental agency reliability objectives.  You will develop new techniques and analytical tools to assure the early identification of potential problems with new products, packaging, processes, and product reliability. You will provide laboratory findings to support recommendations for changes in the selection and application of components and systems. You may propose changes in design or formulation to improve system and/or process reliability based upon proven laboratory methods.
Responsibilities  
Devise and execute parametric and RF test including bench test emulation with digital and RF test fixtures while utilizing various parametric and RF benchtop test equipment.
Engineering knowledge or coursework in digital CMOS and HBJT RF constructs and associated devices. Perform data analysis and troubleshoot electronic components including semiconductor chips, surface mount components, printed circuit boards and wire-bond and flip chip modules.  Communicate and interface with quality, reliability, and design teams to isolate failures and determine root cause.
Required Experience and Skills
BS degree in electrical or computer engineering with 2 years’ experience; MS degree in electrical or computer engineering with 0 years’ experience. Strong understanding of electrical circuit fundamentals and basic understanding of digital and RF semiconductor fundamentals. Ability to troubleshoot and debug complex systems (hardware and test interfaces).Experience with printed circuit board and chip design schematic capture and layout software tools. Excellent written and verbal communication skills and with the ability to report, as well as present, technical concepts and lab results in a direct and concise manner to a wide range of audiences including more senior engineers and management teams. Advanced analytical skills to analyze problems and technical situations leading to optimal solutions. Proficiency in Microsoft Office software including Outlook, Word, Excel, and PowerPoint.
Desired Experience and Skills
Desirable to have prior knowledge or familiarity in the areas of failure analysis tools and techniques including  Visible, NIR and IR microscopes, X-RAY CT imaging, SEM (scanning electron microscope), Acoustic microscopy (CSAM), Silicon (Si) and Gallium Arsenic (GaAs) wet/dry etching tools and techniques and mechanical polishing and sample preparation techniques.  Experience with digital and RF test equipment and measurements. A great attitude with an eagerness to learn and the ability to adapt to new technical challenges. Ability to build relationships easily and collaborate effectively.