Staff Electrical Engineer

Descripción

The Sr Engineering Group Leader will oversee and optimize die attaching and wire bonding processes in a manufacturing environment. This role requires strong technical expertise in process engineering, leadership skills to manage a team, and the ability to drive continuous improvement initiatives using Six Sigma, DoE, and data analysis tools. The ideal candidate will ensure high-quality production, resolve technical conflicts, and implement best practices to enhance efficiency and yield. 

Responsabilidades

Key Responsibilities:  

• Process Optimization.  

   - Lead the development, optimization, and troubleshooting of die attach and wire bonding processes.  

   - Implement process improvements to enhance yield, quality, and throughput.  

   - Utilize **Design of Experiments (DoE)** to identify critical process parameters and optimize performance.  

 Six Sigma Initiatives:  

   - Apply **Six Sigma Green Belt** (Black Belt preferred) methodologies to reduce defects, improve process capability, and drive continuous improvement.  

   - Lead or support DMAIC (Define, Measure, Analyze, Improve, Control) projects to address process inefficiencies.  

•  Data Analysis & Reporting.  

   - Use statistical tools like JMP or Minitab to analyze process data, identify trends, and make data-driven decisions.  

   - Prepare detailed reports and presentations for stakeholders to communicate findings and recommendations.  

•  Team Leadership.

   - Manage and mentor a team of engineers and technicians, providing technical guidance and fostering a culture of collaboration and innovation.  

   - Conduct regular performance reviews and provide training to develop team members’ skills.  

•  Conflict Resolution.

   - Address technical and interpersonal conflicts within the team or between cross-functional groups.  

   - Facilitate effective communication and problem-solving to ensure smooth operations.  

•  Cross-Functional Collaboration.  

   - Work closely with maintenance, process development, quality assurance, and production teams to ensure alignment on process requirements and goals.  

   - Collaborate with equipment vendors to evaluate and implement new technologies.  

• Compliance & Documentation.  

   - Ensure all processes comply with industry standards (e.g., ISO, IPC) and internal quality requirements.  

   - Maintain accurate documentation of process parameters, procedures, and improvements.  

Experiencia y Habilidades Requeridas

 Qualifications:  

 Education:   Bachelor’s or Master’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, Industrial Engineering, or a related field.  

Experience:  

   - 5+ years of experience in die attach and wire bonding processes within the electronics manufacturing industry.  

   - Proven experience in leading engineering teams and managing complex projects.  

Experiencia y Habilidades Deseadas

 Technical Skills:  

   - Strong knowledge of die attach and wire bonding technologies, materials, and equipment.  

• Well-versed in RCA, pFMEA, 8D, and Quality Control Plan development.

   - Proficiency in Six Sigma methodologies (Green Belt required, Black Belt preferred).  

   - Expertise in Design of Experiments (DoE) and statistical analysis tools like JMP or Minitab.

   - Familiarity with process control systems and automation.  

 Soft Skills:  

   - Excellent leadership, communication, and interpersonal skills.  

   - Strong problem-solving and conflict resolution abilities.  

   - Ability to work under pressure and meet tight deadlines.