Staff Physical Failure Analysis Engineer

Date: Jun 18, 2022

Location: Newbury Park, CA, US

Company: Skyworks

 

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking.  Our work culture values diversity, social responsibility, open communication, mutual trust and respect.  We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.

Requisition ID: 66545 

Job Responsibilities

Day-to day responsibilities include but not limited to

•Develops techniques and maintains procedures for physical failure analysis using laser/acid/plasma decapsulation, mechanical x-section, ion milling, parallel polishing (package, die level), die level delayering (RIE, mechanical, wet etch), and die extraction for re-packaging
•Develops proficiency in die delayering techniques for Si, SOI, SiGe, and III-V technologies
•Develops proficiency in performing AFP/Nanoprobing, including required sample preparation
•Documents and maintains procedures and provides training guides as needed
•Provides training for other Technicians and Engineers

•Performs physical analysis and AFP/Nanoprobing requests and issues comprehensive failure analysis reports as required
•Resolves a wide range of issues in imaginative as well as practical ways
•Works on problems of diverse scope where analysis of data requires evaluation of identifiable factors
•Demonstrates good judgment in selecting methods and techniques for obtaining solutions

Job Qualifications

•BS in Electrical Engineering, Materials Science, Chemistry, or Physics and 8-10 years’ experience in physical semiconductor Failure Analysis

•Knowledge and experience of semiconductor fab process and multi-chip (MCM) packaging and assembly

•Hands-on lab experience and demonstrated proficiency in performing:◦Optical Microscopy
◦X-ray/CT reconstruction
◦C-SAM
◦IR inspection
◦Soldering/De-soldering/Re-balling (BGA and WLCSP)
◦Mechanical/Laser/acid/plasma decapsulation
◦Mechanical x-section and ion milling
◦Parallel polishing (package, die level)
◦Die level delayering (RIE, mechanical, wet etch, PFIB) on Si, SiGe, and III-V technologies
◦Die extraction for re-packaging
◦SEM/EDX
◦AFP/Nanoprobing

•Proficient with MS Office, particularly with MS Excel software
•Ability to successfully develop and present reports/presentations
•Excellent verbal and written communication skills
•Ability to successfully communicate with individuals at all levels of the business and demonstrates strong interpersonal skills
•Utilizes a proactive and persistent approach and demonstrates a sense of urgency
•Ability to handle multi tasks simultaneously and efficiently
•Ability to complete work in a timely manner and prioritize jobs in accordance with requirement

 

Preferred Qualifications

MS/PhD in Electrical Engineering, Materials Science, Chemistry, or Physics with 3-6 years’ experience in semiconductor Physical Failure Analysis

TEM/FIB/PFIB experience

HBT experience preferred

What We Offer

Competitive base salary with world class health benefits, Retirement benefits, vacation, wellness time off and many more! A collaborative work environment that includes dynamic &smart people.
 

Join us and help shape the future of wireless!

Apply Now!

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Skyworks is an Equal Opportunity Employer.  All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.


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