Senior Manager, Engineering (SAW Wafer Level Packaging)

Description

Skyworks is seeking a Wafer Level Packaging Technology Development Senior Manager to lead our team in driving technological advancements, push the boundaries of our technology and improve the overall SAW Development Organization within the SAW Filter New Product / New Technology Group. As a highly skilled and strategic leader, you will play pivotal role to successfully deliver new technologies meeting Performance, Quality and Time-to-Market. Having affinity with innovative solutions which can be applied throughout development to high-volume manufacturing, you will ensure a seamless communication across various department in a multicultural environment with teams like Products Engineers, Device, Process experts, Module Design Team, Program Management and Operations.
 

Responsibilities

The Wafer Level Packaging Development Senior Manager will report directly to the head of the SAW Technology Team and will drive innovation in Wafer Level Packaging Technologies. You will be located in Osaka, Japan. The job will involve the following functions:

• Develop and implement a comprehensive Technology Development strategy aligned with company’s overall goals.
• Lead, mentor and inspire a multidisciplinary team of Process Engineers, while fostering a culture of innovation, continuous improvement within the technology team.
• Collaborate with cross-functional teams to define project scope, goals, and deliverables.
• Drive end-to-end development lifecycle, ensuring development projects are delivered to production release, meeting Quality, Performance and Schedule.
• Conduct detailed assessment of new technologies and equipment, making recommendation for adoption or enhancement.
• Identify potential risks/challenges in technology development projects and develop mitigation plans.
• Work with the NPI Team and assist in transition of design prototypes into cost efficient and high-volume manufacturable technologies.
• Collaborate and openly debate with team to manage projects, solve problems, discuss challenging issues, and learn more about critical issues as a group.
• Implement or improve solutions to minimize disruptions in the NTI/NPI workflow.
• Identify and drive continuous improvement in your organization, NTI process and associated department through feedback loops to capture lessons learned from each Technology Project.
• Report and maintain knowledge on Technology status to executive leadership by preparing appropriate reports.

Required Experience and Skills

• M.S. or Ph.D. in Engineering, Material Science, Physics, RF Engineering preferred.
• Minimum of 8 years of experience in Technology Development or Integration including following processes: Lithography, Polymer Patterning, Wafer Bonding, Solder Plating, Laser/Plasma Dicing
• Knowledge in Material properties and modelling (Ansys, FEM)
• Excellent leadership, communication with interpersonal skills and used to work in a multi-cultural environment.
• Experience in SAW/BAW Technology Development and manufacturing.
• Knowledge in Project Management .
• Strong analytical and problem-solving skills, both technical and interpersonal.
• Pragmatic and flexible attitude with a result- and data-driven can-do mentality.
• Works autonomously, well-organized, with a good attention to detail, while setting high standards in all aspects of the work. 

About Us

勤務地

大阪事業所（本社）: 〒559-0026　大阪市住之江区平林北1-2-150 
大阪メトロ 四つ橋線 「北加賀屋」 駅からバスで10分
「平林北一丁目」バス停 下車

勤務時間

8:30–17:00　（所定労働時間：7時間45分 / 休憩時間：45分）
フレックスタイム制度　あり

休日・休暇

年間休日：127日（2024年4月～2025年3月）
完全週休二日制（土・日・祝）
長期連休あり*（年末年始・ゴールデンウイーク） *ただし交替制勤務者は除く
年次有給休暇**（初年度は、入社月により3日から22日、2年目以降は25日） **5日間の計画的付与により、夏季長期連休を推奨

待遇・福利厚生

昇給：年1回
賞与：年1回（業績により変動）
交通費（会社規定に基づき支給）
社会保険（健康保険・厚生年金保険・労災保険・雇用保険）
確定拠出型年金制度
財形貯蓄・社員持株会
転居補助制度（入社時に転居が必要な場合のみ、会社規定に基づき支給）
慶弔休暇・弔慰金・各種見舞金制度