Sr. Packaging Engineer

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Date: Sep 19, 2024

Location: Osaka, 27, JP

Company: Skyworks

 

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking.  Our work culture values diversity, social responsibility, open communication, mutual trust and respect.  We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.

Requisition ID: 74126 

 

Job Description

We are looking for a process engineer to work on BAW filter package and back-end process development. In this role, you will be in charge of machining-related processes such as backside grinding, edge trimming, mounter, and UV related to the development of new technologies and processes related to the back end, and you will be responsible for promoting the processes you are responsible for from development to mass production in order to realize the early launch of high-quality, high-yield products. Since the processes involved in each development project are different, you will be in charge of a team of multiple people and will proceed with development in cooperation with multiple departments, so you can acquire a broad perspective that looks at the entire company.

  • You will be in charge of the development of new technologies and processes related to the backend, mainly backside grinding, edge trimming, mounter, and UV processes.
  • When introducing new technologies, you will be asked to build an optimal process flow that ensures compatibility and efficiency with existing processes.
  • In order to ensure stable yields, characteristics, and reliability, we will introduce appropriate inspections and set targets and specifications in each process.
  • Analyze yield data, identify root causes, and promote improvement activities such as process optimization and variation improvement.
  • Work closely with design, manufacturing, quality assurance, and front-end development members to resolve technical issues.
  • You will be asked to set and verify design rules.

Job Description

  • At least 3 years of experience as an engineer in the electronic components and semiconductor industry
  • Knowledge of wafer bonding processes (backside grinding, edge trimming, mounters, UV, related equipment, etc.) in electronic component and semiconductor manufacturing
  • Basic business IT skills such as Windows, Excel, PowerPoint, etc.
  • Experience in process flow construction and optimization (including establishment of measurement methods) and process structure design for electronic components or semiconductor devices
  • Experience in the development of new processes and products in electronic components or semiconductor devices
  • Experience in clean room work and handling various measurements (CD-SEM, film thickness measurement, etc.)
  • Experience in various data analysis using various analysis tools such as Exensio and JMP
  • Excellent communication skills, writing and presentation skills in English

Skyworks is an Equal Opportunity Employer.  All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.


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