Wafer Bonding Integration Senior Principal Engineer

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Date: Apr 11, 2024

Location: Osaka, 27, JP

Company: Skyworks

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking.  Our work culture values diversity, social responsibility, open communication, mutual trust and respect.  We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.

Job Description

Skyworks is seeking a highly skilled and experienced Wafer Bonding Integration Engineer. As a key member of our engineering team, you will drive the development and integration of advanced wafer bonding technologies. Having an affinity with innovative solutions which can be applied throughout development to high-volume manufacturing, you will work with a multicultural and cross-functional team like R&D Engineers, Device, Process experts, Operations, and suppliers as well.

The Wafer Bonding Integration Engineer will be part of the SAW Technology Development and play a pivotal role in the industrialization of the new wafer bonding applications. The position is located in Osaka, Japan and provides expertise in Fusion Bonding processes. The job will involve the following functions:

  • Lead the design and implementation of Wafer Bonding integration processes, ensuring best performance and reliability.
  • Work cross-functionally to define integration requirements and establish best practices for wafer bonding technologies according to product requirement.
  • Drive innovation in wafer bonding methodologies, benchmark/evaluate new bonding technologies / solutions and stay updated on industry innovations and state-of-the-art techniques.
  • Provide technical leadership and mentorship to junior engineers
  • Conduct deep dive analyses and troubleshooting of wafer bonding integration issues, leading and implementing corrective actions as necessary.  
  • Collaborate with R&D teams to transition from concept to high-volume manufacturing.
  • Lead the industrialization project and be accountable for deliverables, milestones, and budget.  

 

Requirements

Master’s Degree in Electrical engineering, Computer Science, Physics, or related field.

  • Minimum of 12 years of experience, with 8 years in Wafer Bonding technology.
  • Expertise in Fusion Bonding is required.
  • Additional Experience in Piezo Material technologies is a plus.
  • Knowledge in the use of Design of Experiments, statistical process control and analysis tools.
  • Strong understanding of material characterization and analysis techniques relevant to wafer bonding.
  • Strong analytical and problem-solving skills, both technical and interpersonal.
  • Pragmatic and flexible attitude with a result- and data-driven can-do mentality.
  • Works autonomously, well-organized, with a good attention to detail, while setting high standards in all aspects of the work.
  • Excellent communication skills, professional level of written and verbal communication in English.
  • Ability to convey complex technical concepts to diverse audiences.

 

 Skyworks is an Equal Opportunity Employer.  All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.


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