If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.
Requisition ID: 76941
Summary
Looking for a Principal Packaging Engineer to support packaging process engineering. The candidate will be lead frame package assembly engineer (leaded and leadless package such as QFN, QSOP, SOIC, etc) mainly and also prefer to laminate package assembly, bumping process experienced who has interface between design teams and SWKS internal/external OSAT manufacturing.
Job Responsibilities
- Working with Development teams to define Risk Assessment, Mitigation planning.
- Ownership of specific products from feasibility stage to high volume production.
- Ensuring that DFM/BKM is implemented for assembly yield, cost, and reliability.
- Developing new assembly technologies, running process DOE’s, identifying new materials and equipment, reliability testing, and qualification of the new assembly process.
- Working with both internal assembly factory and external OSATs
- Develop and improve the quality performance of Suppliers
- Work together with supplier for any process excursion and issue to achieve timely and comprehensive corrective, preventive actions
- Drive OSAT to improve and manage assembly yield/data reporting, and ensure continuous improvement
- Review PPM/Yield/SPC trend daily bases for especially critical part numbers
- Review CTQ’s for both input & Output in a regular basis
- Cost Reductions
- Yield improvement/enhancements
- Deliver results as measured by key metrics, such as supplier yield, field cost, field defect rate, customer spills & RMA’s, supplier quality plan effectiveness, and corrective & preventive action closure, CPK’s, GR&R.
- Assure correct NPI deployment assuring quality and fast release
- Investigating and resolving non-conformances and escapes by utilizing industry and Skyworks investigation tools and practices, DMAIC, 8-D, FMEA, and driving initiatives to implement robust root cause corrective actions and mistake proofing.
- Provide support to Supply Chain Sourcing initiatives and product transfers; and Develop validation documentation to support new product development and changes to existing products
Job Requirements
- High proficiency in English communication at business level.
- Minimum a Bachelor's Degree qualification in Material Science, Material Engineering, Chemical, Mechanical Engineering, Semiconductor Engineering and other related specialization.
- Minimum 12 years of relevant technical experience in semiconductor packaging technology.
- Hands-on experience in Lead frame package assembly, wire bonding (Au, PCC, APC Cu wire), die attach material, compression and transfer mold process, lead plating, and Lead frame manufacturing process, LF design review capability.
- Plus process knowledge for Bumping, SMT, Flip Chip, WLCSP, EMI Shielding process and Advanced laminate packaging technology.
- Technical expertise required in failure analysis, material interaction, and yield improvement.
- Strong understanding of SPC techniques, FMEAs, Six Sigma, 8D, Control Plan and Reliability Standard.
- Understanding of Module and Board Level Reliability requirements.
- Team player with good interpersonal skills and able to work efficiently with multi-functional and multi-cultural groups.
- Proactive Individual who can work on the move.
- Strong project management and communication skills (verbal, written, and presentation).
- Able to Travel.
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.