RF SiP Design Leader - Director, Engineering

Overview

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog/digital, &RF semiconductors, Acoustic Filters and integrating ultra-dense System-in-Package solutions that will be powering the next wireless transformation. Together, we will build the next generation of wireless platforms focused on enabling the Automotive Industry, Cellular Infrastructure, Smart Houses/Smart Cities through IoT, and the AI/ML revolution. Through our broad technology/packaging expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time. 

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Summary
The Diversified Analog Solution (DAS) Business Unit covers a wide range of established and emerging market segments, including WiFi, automotive, IoT, and infrastructure. As a leader in the System Architecture team of DAS BU, you will lead the overall strategy, planning and execution of the packaging technology development through an innovative mindset and working with your cross functional peers, within and outside of the business unit to take projects from initial definition, through design implementation cycles, and launch the projects to mass production.

Responsibilities

• Serve as the subject matter expert for package design and process development for new technologies and establish baselines for assembly and packaging including:
  • SMT
  • Flip chip
  • Die attach, molding, underfill, dispense, EMI shielding, lid, and solder ball attach
  • 3D stack die technology
  • Heterogeneous integration 
• Collaborate, contribute to and drive implementation of advanced packaging and assembly technologies across the BU’s product portfolio
• Develop and own packaging assembly processes including material characterization and down-selection for wafer-level and chip-level systems
• Serve as DAS BU interface with TMG for all new technology introduction (NTI) for assembly packaging lines
• Identify and define package cost breakdown and package cost reduction opportunities 
• Provide packaging expertise to design engineering leads and teams to refine the packaging design in process development. 
• Provide frequent technical seminars to the engineering community to drive and enhance understanding of upcoming state-of-the-art packaging technologies
• Provide technical expertise in customer meetings and represent the voice of customer internally to deliver to expectations

Qualifications

• Master’s degree in Mechanical Engineering, Material Science, Applied Physisc or related discipline
• 15+ years of consumer electronics or semiconductor industry experience
• Hands-on packaging, PCBA, and SMT assembly experience
• Experience with technology and product planning and development cycles
• Strong communication skills
• Track record of in developing new RF package designs and deploying them into High-Volume manufacturing environments 
• Experience in working with OSAT companies in Asia 
• In-depth experience in assembly and module design, from highly integrated SiP to high-power amplifiers
• Experience in CAD layout and simulation tools