Engineering Associate

Job Responsibilities

• Monitor daily operations to detect abnormal broken wafer patterns and identify systematic issues.
• Coordinate shift work among technicians and operators, resolving daily operational challenges.
• Prepare and present daily broken wafer yield reports during meetings.
• Investigate broken wafers to determine root causes and track events for corrective actions.
• Evaluate broken wafer corrective improvement plans (CIP) and analyze defect-related yield losses for SAW product lines.
• Implement crack inspection strategies to quickly address wafer cracks and tool-related issues.
• Perform first-level commonality analysis and involve process and equipment engineers as needed to resolve issues.
• Act as the primary owner of OCAP (Out-of-Control Action Plan) decisions, including stopping production machines for investigations.
• Approve machine buyoff methods following OCAP guidelines and authorize machines to return to production.
• Monitor change points and provide feedback on evaluation results.
• Assist in developing new methods or improvements (CIP) for existing jigs/tools to enhance productivity.
• Support engineers in short-term problem-solving and long-term improvement initiatives.
• Create training documents or PCI (Process Control Instructions) to standardize Best Known Methods (BKM) for onboarding new team members.
• Continuously observe commonality, defect patterns, and identify opportunities to achieve targeted package yield.

Job Requirements

• Diploma in Electronic Engineering, Computer Science, or equivalent qualifications.
• Ability to understand Quality & Yield performance across products, processes, and equipment.
• Familiarity with the Back-End (BE) SAW process from wafer start to final testing stages.
• Experience working with cross-functional teams, including production, equipment, and process teams, for data collection, analysis, or experiments.