Description

The candidate will help staff, and lead MSB’s Analog/RF Design Team in Bengaluru with a mission of building a strong team focused on RF/Analog IC design. This team will be a key part of our Mobile Solutions Business, which consists of highly integrated front end modules that integrate Filters, Switches, LNAs, and matching in densely packed & complex front-end modules for Cellular and WiFi applications. The team will work directly and closely with design teams in the US.

As the Analog/RF manager, you will be responsible for a team of engineers driving IC block-level designs and layout. You and your team will engage in frequent technical meetings and design reviews with chip leads and counterparts abroad.  

In this position, you have the opportunity to make uniquely large impact on the success of the company and will have visibility at the highest levels of the company.

We are looking for a passion to win/contribute and ability to work in, and thrive in, a fast-paced dynamic team environment.

Responsibilities

The candidate will report to the Engineering Director locally and have a team of Engineers reporting to them. These Engineers will have a matrix reporting structure to various teams in US doing IC design. 

Responsibilities will include, but not be limited to:

1. Recruiting & Staffing:

1. 1. Jointly drive staffing & recruiting with HR to ensure a world-class team is brought together to execute on complex, highly critical programs.
2. Technical Leadership:
   1. Act as the IC Design & Technical Leader for a team focused on the design of complex front- end modules
   2. Experience managing large technical teams
   3. A track record of growing successful design teams
   4. Ability to set & articulate clear goals and drive accountability to those 
   5. Use of AI tools to improve productivity, efficiency, automation, bug-tracking and reporting
3. Communication:
   1. Drive company communications, strategy, and goals via team meetings and regular 1:1 and reporting to chip leads and managers in the US.
4. Travel to US will be required from time to time

Required Experience and Skills

1. The candidate must have excellent written and spoken communications, sufficient to present program technical status & schedule progress to senior management.
2. EDA & Software tools:
   1. Strong experience with the Cadence suite of EDA tools
   2. Knowledge of commonly used IC layout tools
   3. Knowledge of 2D/3D EM simulation tools
   4. Experience with PVT and statistical simulations
3. Circuit Design:
   1. Broad and deep expertise in core Analog Design including low bit count data converters (ADC & DAC blocks), Bandgaps, Op-Amps, Bias blocks, Charge-pumps, Temp sensor, Clock and timing, LDO, ESD, e-fuse and other supporting cells.
   2. Good understanding of RF SOI technology including RF switch, tuning & RF LNA design.
   3. Basic Digital Design including SPI & MIPI interface design, Decoding logic, and simple state machines.
   4. Semiconductor process knowledge including SOI, bulk CMOS, SiGe.
   5. Must understand the basic device physics, ability to develop and use advanced linear and nonlinear models or simulation techniques and be able to translate between the model, simulation, physical implementation, and the measured performance of a device

4. Working knowledge of RF multi-chip modules including 3D Packaging, assembly, thermals and EMI basics.

Knowledge of test equipment and common tests and parameters

Minimum Requirements

Minimum Requirements:          

1.  
   1. BSEE; MS preferred
   2. 10+ years of IC Design experience
   3. 6+ years of Technical Leadership and Management experience