|
Grinding / Trimming / Taping Engineer (Sr. Equipment Engineer)
|
Osaka, 27, JP
|
Engineering Support
|
|
|
Wafer Bonding Engineer (Sr. Equipment Engineer)
|
Osaka, 27, JP
|
Engineering Support
|
|
|
Co-Op - Test Engineer
|
Newbury Park, CA, US
|
Student
|
|
Intern
Intern
Irvine, CA, US
Oct 15, 2025
|
Irvine, CA, US
|
Student
|
|
|
Sr. Manager, Engineering
|
Ottawa, ON, CA
|
Engineering
|
|
|
Sr. Accountant
|
Irvine, CA, US
|
Finance & Accounting
|
|
|
Process Metrology Engineer (Sr. Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Intern- Analog design
|
Bengaluru, KA, IN
|
Student
|
|
Intern
Intern
Bengaluru, KA, IN
Oct 15, 2025
|
Bengaluru, KA, IN
|
Student
|
|
|
Sr. Manager, Engineering
|
Mexicali, BCN, MX
|
Ingenieria
|
|
|
PDV, Integration, Design Engineer (Packaging Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
SAW Solder Printing Engineer (Sr. Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Equipment Engineering Tech 6
|
Mexicali, BCN, MX
|
Ingeniero de Soporte
|
|
|
Equipment Engineering Tech 3
|
Mexicali, BCN, MX
|
Ingeniero de Soporte
|
|
|
RFIC Design (12-month Co-Op)
|
Ottawa, ON, CA
|
Student
|
|
|
Business Analyst - Demand Management
|
Irvine, CA, US
|
Enterprise Analytics
|
|
|
Intern/Co-op for development Data Processing Automation System
|
Chu Pei, HSQ, TW
|
Student
|
|
|
RF Design Engineering Co-Op (June '26 - Dec '26)
|
Andover, MA, US
|
Student
|
|
|
RF Acoustic Wave Filter Design - Staff Electrical Engineer
|
Irvine, CA, US
|
Engineering
|
|
|
RF SW IC Design Co-op (Summer/Fall 2026)
|
Cedar Rapids, IA, US
|
Student
|
|
|
Analog IC Design Co-Op (Summer/Fall 2026)
|
Cedar Rapids, IA, US
|
Student
|
|
|
Senior Integration Engineer (Staff Packaging Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Integration + Wafer Bonding (Staff Packaging Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
RF Module Design Co-op (Winter/Spring 2026)
|
Cedar Rapids, IA, US
|
Student
|
|
|
RF Design Engineering Co-Op (Jan '26 - June '26)
|
Andover, MA, US
|
Student
|
|
