|
Supply Chain-Winter/Spring Co-Op
|
San Jose, CA, US
|
Student
|
|
|
Engineering Technician 5
|
Mexicali, BCN, MX
|
Engineering Support
|
|
|
Supervisor 3, Operations
|
Mexicali, BCN, MX
|
Operations
|
|
|
IC Design - Winter/Spring Co-Op (Jan '26 - June '26)
|
Andover, MA, US
|
Student
|
|
|
Wafer Bonding Engineer (Sr. Equipment Engineer)
|
Osaka, 27, JP
|
Engineering Support
|
|
|
Grinding / Trimming / Taping Engineer (Sr. Equipment Engineer)
|
Osaka, 27, JP
|
Engineering Support
|
|
|
Co-Op - Test Engineer
|
Newbury Park, CA, US
|
Student
|
|
|
RF Acoustic Wave Filter Design - Staff Electrical Engineer
|
Irvine, CA, US
|
Engineering
|
|
|
Senior Integration Engineer (Staff Packaging Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
SAW Solder Printing Engineer (Sr. Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
PDV, Integration, Design Engineer (Packaging Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Integration + Wafer Bonding (Staff Packaging Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Design Automation Engineer 2
|
Bengaluru, KA, IN
|
Engineering
|
|
|
Sr. Manager, Engineering
|
Mexicali, BCN, MX
|
Ingenieria
|
|
|
RF Module Design Co-op (Winter/Spring 2026)
|
Cedar Rapids, IA, US
|
Student
|
|
|
RF Module Design Co-op (Summer/Fall 2026)
|
Cedar Rapids, IA, US
|
Student
|
|
|
Analog IC Design Co-Op (Summer/Fall 2026)
|
Cedar Rapids, IA, US
|
Student
|
|
|
Analog IC Design Co-Op (Winter/Spring 2026)
|
Cedar Rapids, IA, US
|
Student
|
|
|
RF SW IC Design Co-op (Summer/Fall 2026)
|
Cedar Rapids, IA, US
|
Student
|
|
|
IC Layout Design Co-op (Winter/Spring 2026)
|
Cedar Rapids, IA, US
|
Student
|
|
|
Senior Manager, Engineering (SAW Wafer Level Packaging)
|
Osaka, 27, JP
|
Engineering
|
|
|
Sr. Sustainability Program Manager
|
Irvine, CA, US
|
Project, Facilities and Administration
|
|
|
EM / MCM Staff Design Engineer
|
Irvine, CA, US
|
Engineering
|
|
|
Sr. Design Engineering Manager
|
Ottawa, ON, CA
|
Engineering
|
|
|
Sr. Principal, Enterprise Architect
|
Bengaluru, KA, IN
|
Information Technology
|
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