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RF Test Engineering Co-Op (Winter/ Fall 2026)
RF Test Engineering Co-Op (Winter/ Fall 2026) Ottawa, ON, CA Aug 29, 2025
Ottawa, ON, CA Student
RFIC Design (12-month Co-Op)
RFIC Design (12-month Co-Op) Ottawa, ON, CA Sep 5, 2025
Ottawa, ON, CA Student
Test Engineering 12-month Co-Op
Test Engineering 12-month Co-Op Ottawa, ON, CA Sep 8, 2025
Ottawa, ON, CA Student
Test Engineering Co-Op (Jan '26 - Dec '26)
Test Engineering Co-Op (Jan '26 - Dec '26) Ottawa, ON, CA Sep 9, 2025
Ottawa, ON, CA Student
RF Engineering Co-Op (12 month)
RF Engineering Co-Op (12 month) Ottawa, ON, CA Sep 9, 2025
Ottawa, ON, CA Student
RFIC Design 12-month Co-Op (Jan '26 - Dec '26) Ottawa, ON, CA Student
Senior Manager, Engineering (SAW Wafer Level Packaging) Osaka, 27, JP Engineering
Senior Integration Engineer (Staff Packaging Engineer) Osaka, 27, JP Engineering
SAW Solder Printing Engineer (Sr. Process Engineer) Osaka, 27, JP Engineering
PDV, Integration, Design Engineer (Packaging Engineer) Osaka, 27, JP Engineering
Integration + Wafer Bonding (Staff Packaging Engineer) Osaka, 27, JP Engineering
Wafer Bonding Engineer (Sr. Equipment Engineer) Osaka, 27, JP Engineering Support
Grinding / Trimming / Taping Engineer (Sr. Equipment Engineer) Osaka, 27, JP Engineering Support
Test Engineer 2
Test Engineer 2 Osaka, 27, JP Aug 21, 2025
Osaka, 27, JP Engineering
Under Bump Metallization Engineer (Sr. Process Engineer) Osaka, 27, JP Engineering
Dry Etching Engineer (Sr. Process Engineer)
Dry Etching Engineer (Sr. Process Engineer) Osaka, 27, JP Aug 22, 2025
Osaka, 27, JP Engineering
Interpreter (Project Coordinator)
Interpreter (Project Coordinator) Osaka, 27, JP Aug 24, 2025
Osaka, 27, JP Operations
Interpreter (Project Coordinator)
Interpreter (Project Coordinator) Osaka, 27, JP Aug 24, 2025
Osaka, 27, JP Operations
Trimming Staff Process Engineer
Trimming Staff Process Engineer Osaka, 27, JP Aug 27, 2025
Osaka, 27, JP Engineering
Dry Etching Engineer (Sr. Process Engineer)
Dry Etching Engineer (Sr. Process Engineer) Osaka, 27, JP Aug 27, 2025
Osaka, 27, JP Engineering
AOI, Metrology Engineer (Sr. Packaging Engineer) Osaka, 27, JP Engineering
Grinding Engineer (Sr. Packaging Engineer)
Grinding Engineer (Sr. Packaging Engineer) Osaka, 27, JP Aug 31, 2025
Osaka, 27, JP Engineering
Wet Process Engineer (Sr. Process Engineer)
Wet Process Engineer (Sr. Process Engineer) Osaka, 27, JP Aug 31, 2025
Osaka, 27, JP Engineering
Staff Electrical Engineer
Staff Electrical Engineer Osaka, 27, JP Sep 1, 2025
Osaka, 27, JP Engineering
Deposition Engineer (Sr. Process Engineer)
Deposition Engineer (Sr. Process Engineer) Osaka, 27, JP Sep 6, 2025
Osaka, 27, JP Engineering