|
Plating Engineer (BAW/SAW) (Sr. Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
PDV, Integration, Design Engineer (Packaging Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
PCB/RF Design Engineer
|
Newbury Park, CA, US
|
Engineering
|
|
|
PCB Rework and Assembly Technician
|
San Jose, CA, US
|
Engineering Support
|
|
|
PA IC design - Winter/Spring Co-Op
|
Newbury Park, CA, US
|
Student
|
|
|
P/T Temporary Packaging Engineering Technician 2
|
Irvine, CA, US
|
Engineering Support
|
|
|
OTP Memory Development Engineer
|
Cedar Rapids, IA, US
|
Engineering
|
|
|
Operator 4 (SFS only)
|
Singapore, 04, SG
|
Operations
|
|
|
Operator 4 (SFS only)
|
Singapore, 04, SG
|
Operations
|
|
|
Operator 3 (SFS Only)
|
Singapore, 04, SG
|
Operations
|
|
|
Operator 3 (SFS Only)
|
Singapore, 04, SG
|
Operations
|
|
|
Operador con Secundaria
|
Mexicali, BCN, MX
|
|
|
|
Operador con Secundaria
|
Mexicali, BCN, MX
|
|
|
|
Operador con Preparatoria
|
Mexicali, BCN, MX
|
|
|
|
Operador con Preparatoria
|
Mexicali, BCN, MX
|
|
|
|
NPI Automation Engineering Co-Op (Winter/Spring 2026)
|
Irvine, CA, US
|
Student
|
|
|
NPI Automation Engineering Co-Op (Summer/Fall 2026)
|
Irvine, CA, US
|
Student
|
|
|
Module Design Co-Op (June '26 - Dec '26)
|
Irvine, CA, US
|
Student
|
|
|
Modeling Engineer Co-Op (Winter/Spring 2026)
|
Irvine, CA, US
|
Student
|
|
|
Microelectronics Packaging Engineering Co-op (Winter/Spring 2026)
|
Cedar Rapids, IA, US
|
Student
|
|
|
Metrology Engineer (Sr. Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Materials/Planning Specialist 2
|
Bengaluru, KA, IN
|
Supply Chain & Sourcing
|
|
|
Materials/Planning Specialist 2
|
Singapore, 02, SG
|
Supply Chain & Sourcing
|
|
|
Materials/Planning Specialist - Contract
|
San Jose, CA, US
|
Engineering Support
|
|
|
Materials Support Specialist
|
Newbury Park, CA, US
|
Supply Chain & Sourcing
|
|
