|
Wet Process Engineer (Sr. Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Grinding Engineer (Sr. Packaging Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
AOI, Metrology Engineer (Sr. Packaging Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Sr. EHS Engineer 2
|
Osaka, 27, JP
|
Project, Facilities and Administration
|
|
|
Sr. EHS Engineer 2
|
Osaka, 27, JP
|
Project, Facilities and Administration
|
|
|
Staff Electrical Engineer
|
Osaka, 27, JP
|
Engineering
|
|
|
Senior Manager, Engineering (SAW Wafer Level Packaging)
|
Osaka, 27, JP
|
Engineering
|
|
|
SAW Solder Printing Engineer (Sr. Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Grinding / Trimming / Taping Engineer (Sr. Equipment Engineer)
|
Osaka, 27, JP
|
Engineering Support
|
|
|
Wafer Bonding Engineer (Sr. Equipment Engineer)
|
Osaka, 27, JP
|
Engineering Support
|
|
|
Test Engineer 1
|
Osaka, 27, JP
|
Engineering
|
|
|
Sr. CAD Engineer 2
|
Osaka, 27, JP
|
Engineering Support
|
|
|
Backend Integration Engineer (Sr. Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Under Bump Metallization Engineer (Sr. Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Dry Etching Engineer (Sr. Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Dry Etching Staff Engineer (Staff Process Engineer)
|
Osaka, 27, JP
|
Engineering
|
|
|
Interpreter (Project Coordinator)
|
Osaka, 27, JP
|
Operations
|
|
|
Interpreter (Project Coordinator)
|
Osaka, 27, JP
|
Operations
|
|
|
Sr. Design Engineering Manager
|
Ottawa, ON, CA
|
Engineering
|
|
|
RFIC Design and Validation Co-op (12-month)
|
Ottawa, ON, CA
|
Student
|
|
|
RF Test Engineering Co-Op (Winter/ Fall 2026)
|
Ottawa, ON, CA
|
Student
|
|
|
Quality Systems - Data Analyst Co-Op
|
Ottawa, ON, CA
|
Student
|
|
|
RFIC Design (12-month Co-Op)
|
Ottawa, ON, CA
|
Student
|
|
|
Test Engineering 12-month Co-Op
|
Ottawa, ON, CA
|
Student
|
|
|
Test Engineering Co-Op (Jan '26 - Dec '26)
|
Ottawa, ON, CA
|
Student
|
|
